Overbond, an innovative fintech platform engaged in the institutional fixed income markets, is pleased to present their inaugural hackathon!   Taking place in E5 3101 and 3102 starting Friday, June 17 and lasting until Sunday, June 19, come for an amazing weekend of hacking and a chance to interview for an internship or full-time position at Overbond while meeting new like-minded people and having fun.  There is a first place prize of $1000 and food and drinks will be provided!

To sign up, visit bit.do/overbonduw.  Don’t forget to also visit https://goo.gl/6E5yTZ for more details and https://goo.gl/LXdlZn for the Facebook event page.

Hope to see you there!